Solder paste stencils allow to quick and accuratelly apply paste to the pcb's for surface mount devices soldering.
The use of stencils reduces the ammount of solder bridges and allows for the solder to be better distributed over the pad and so a better adesion to the component.
These low cost stencils, althought not as durable as the steel ones, are durable enough for a small batch production and prototyping.
The material used in these stencils is able to be used with fine pitch components as the ones found in packages like QFN, LGA, etc.
You can panelize as many boards as you want till you fit the size chosen.
We will position your design in the lower left corner of the sheet. If you need some diferent position let us know in the comment area.
- 0.1mm or 0.2mm Polyethylene Terephthalate (PET) film
- 0.2mm minimum aperture
- Gerber file (with only the paste layer)
- Filename should identify your project and the date sent. ex. project1_01012013.gbr
Note: If you want a panel with multiple boards, even if copies, you have to make it yourself and send us the corresponding gerber. We do not process your gerbers. Send us an email if you have any doubts about how to make a panel.